EKF
EKF AC600 & AC610 DIN Rail Boxed PC
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Technical Datasheets / Product Documentations
General
Low Power X86 based boxed PC, for DIN rail mount or wall mountIntel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable AC600/AC610 versions)Versatile standard front I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)Choice of two versions - without (AC600) or with (AC610) wireless networkingSMA/SMA-RP antenna connectors (AC610)Dimensions: 30mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC600)Dimensions: 40mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC610)Metal case, TS35 DIN rail bracket or wall mount plateM12 power connectorOption terminal block power connectorOption desktop power adapter connectorNominal 12V/24VDC power input operation
Front I/O
Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate front portsDual USB 3.0 Type-A receptaclesDual DisplayPort connectorsM12-A DC power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)
Additional I/O AC610
AC610 is the wireless version of AC600 with AC010 mezzanine module (40mm front width)SMA/SMA-RP front antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5Dual Micro-SIM card slot for WWAN modem up to 5G
ProcessorIntel® Apollo Lake (APL-I) SoC E39xx Seriesx7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLCx5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLCx5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLCGraphics Burst, CPU Burst, Intel® Speedstep®Intel® Virtualization Technology (Intel® VT-x / VT-d)Intel® Trusted Execution Engine (Intel® TXE) 3.0
FirmwarePhoenix® UEFI (Unified Extensible Firmware Interface) with CSM*Fully customizable by EKFSecure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®Windows®, Linux and other (RT)OS' supported* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'
Main MemoryIntegrated memory controller up to 8GB DDR3L 1600 +ECCSoldered memory for rugged applications
Mass StorageOn-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)Up to 2TB capacity as of current - refer to AC600/610 SKUsOption front I/O Micro SD Card socket (SDHC, SDXC), available on requestSPI Flash 128Mbit (UEFI firmware and customer application data)Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)Option mezzanine storage expansion via P-HSE connector (up to 2 x PCIe®, 1 x USB 3.0)Option custom specific mezzanine board design on request
GraphicsIntegrated HD Graphics Engine, Gen 9 LPDirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8HW video encode H264, SVC, AVC, MVC, MPEG-2Content protection PAVP, HDCP 1.42 x DisplayPort front panel connectorsDisplayPort™ 1.2aMax Resolution 4096 x 2160 @60HzAudio streams encoded
NetworkingDual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connectionsIntel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHYIPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient EthernetIEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streamsIEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronizationTwo front port M12-X connectorsOption 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)
Wireless Networking AC610Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)
APL SoC I/O Usage2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)2 x PCIe® to 2 x I210-IT networking controllers2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)1 x USB 3.0 to P-HSE high speed expansion port connector2 x USB 3.0 to front panel connectors2 x DisplayPort to front panel connectors1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)SDIO (Micro SD Card) front panel slot (option, available on request)LPC to TPM 2.0 module (option)
Building Blocks2 x Gigabit Ethernet controllers Intel® I210IT (front panel)Option 1 x Intel® I210-IS (for SerDes networking expansion port connector P-EXP)M.2 socket for 2280 SSDOption e•MMC (embedded MMC 5.0 64GByte HS400)Option Trusted Platform Module TPM 2.0
AC610 AdditionsM.2 socket for 2230 Wi-Fi moduleM.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)
SecurityTrusted Platform Module (option)TPM 2.0 for highest level of certified platform protectionInfineon Optiga™ SLB 9665 cryptographic processorConforming to TCG 2.0 specificationAES hardware acceleration support (Intel® AES-NI)
Local ExpansionMezzanine card connectors P-HSE and P-EXP for optional local expansionP-HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0Choice of P-HSE based mezzanine I/O or storage modulesAC010 P-HSE based wireless module for Wi-Fi, Bluetooth, WWAN connectivity (AC610)Custom specific P-HSE based mezzanine module designCustom specific box design for utilization of P-HSE custom I/O mezzanine modulesOption P-EXP connector - Gigabit Ethernet SerDes I/F derived from I210-IS NICCustom specific box design for utilization of P-EXP together with Gigabit Ethernet switch cardCustom specific P-EXP based mezzanine switching module design
Power Requirements
DC Input, 9V-30V (12VDC, 24VDC nominal input voltage)Power consumption 25W max.Fast acting chip fuse (PCB soldered type - no replacement on-site)Protected against reverse polarityESD protection (TVS)Common mode input filterM12-A 5-pin front panel power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)
Applications
Ultra compact industrial PCX86 code compatibility for rapid time to marketMachine controlKiosk systems, information panelsDual 4k display solution, independent operationSingle display or headless applicationsIndustrial networks - IIoTCable and wireless networkingRouter, bridgesRugged environments, DIN rail or wall mount optionsEdge computingVehicles, transportation
Environmental, Regulatory
Designed & manufactured in GermanyCertified quality management according to ISO 9001Long term availabilityRugged solutionRoHS compliantOperating temperature -40°C to +85°C (industrial temperature range) availableStorage temperature -40°C to +85°C, max. gradient 5°C/minHumidity 5% ... 95% RH non condensingAltitude -300m ... +3000mShock 15g 0.33ms, 6g 6msVibration 1g 5-2000HzProtection class IP20EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)MTBF tbd years
Low Power X86 based boxed PC, for DIN rail mount or wall mountIntel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable AC600/AC610 versions)Versatile standard front I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)Choice of two versions - without (AC600) or with (AC610) wireless networkingSMA/SMA-RP antenna connectors (AC610)Dimensions: 30mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC600)Dimensions: 40mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC610)Metal case, TS35 DIN rail bracket or wall mount plateM12 power connectorOption terminal block power connectorOption desktop power adapter connectorNominal 12V/24VDC power input operation
Front I/O
Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate front portsDual USB 3.0 Type-A receptaclesDual DisplayPort connectorsM12-A DC power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)
Additional I/O AC610
AC610 is the wireless version of AC600 with AC010 mezzanine module (40mm front width)SMA/SMA-RP front antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5Dual Micro-SIM card slot for WWAN modem up to 5G
ProcessorIntel® Apollo Lake (APL-I) SoC E39xx Seriesx7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLCx5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLCx5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLCGraphics Burst, CPU Burst, Intel® Speedstep®Intel® Virtualization Technology (Intel® VT-x / VT-d)Intel® Trusted Execution Engine (Intel® TXE) 3.0
FirmwarePhoenix® UEFI (Unified Extensible Firmware Interface) with CSM*Fully customizable by EKFSecure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®Windows®, Linux and other (RT)OS' supported* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'
Main MemoryIntegrated memory controller up to 8GB DDR3L 1600 +ECCSoldered memory for rugged applications
Mass StorageOn-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)Up to 2TB capacity as of current - refer to AC600/610 SKUsOption front I/O Micro SD Card socket (SDHC, SDXC), available on requestSPI Flash 128Mbit (UEFI firmware and customer application data)Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)Option mezzanine storage expansion via P-HSE connector (up to 2 x PCIe®, 1 x USB 3.0)Option custom specific mezzanine board design on request
GraphicsIntegrated HD Graphics Engine, Gen 9 LPDirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8HW video encode H264, SVC, AVC, MVC, MPEG-2Content protection PAVP, HDCP 1.42 x DisplayPort front panel connectorsDisplayPort™ 1.2aMax Resolution 4096 x 2160 @60HzAudio streams encoded
NetworkingDual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connectionsIntel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHYIPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient EthernetIEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streamsIEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronizationTwo front port M12-X connectorsOption 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)
Wireless Networking AC610Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)
APL SoC I/O Usage2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)2 x PCIe® to 2 x I210-IT networking controllers2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)1 x USB 3.0 to P-HSE high speed expansion port connector2 x USB 3.0 to front panel connectors2 x DisplayPort to front panel connectors1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)SDIO (Micro SD Card) front panel slot (option, available on request)LPC to TPM 2.0 module (option)
Building Blocks2 x Gigabit Ethernet controllers Intel® I210IT (front panel)Option 1 x Intel® I210-IS (for SerDes networking expansion port connector P-EXP)M.2 socket for 2280 SSDOption e•MMC (embedded MMC 5.0 64GByte HS400)Option Trusted Platform Module TPM 2.0
AC610 AdditionsM.2 socket for 2230 Wi-Fi moduleM.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)
SecurityTrusted Platform Module (option)TPM 2.0 for highest level of certified platform protectionInfineon Optiga™ SLB 9665 cryptographic processorConforming to TCG 2.0 specificationAES hardware acceleration support (Intel® AES-NI)
Local ExpansionMezzanine card connectors P-HSE and P-EXP for optional local expansionP-HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0Choice of P-HSE based mezzanine I/O or storage modulesAC010 P-HSE based wireless module for Wi-Fi, Bluetooth, WWAN connectivity (AC610)Custom specific P-HSE based mezzanine module designCustom specific box design for utilization of P-HSE custom I/O mezzanine modulesOption P-EXP connector - Gigabit Ethernet SerDes I/F derived from I210-IS NICCustom specific box design for utilization of P-EXP together with Gigabit Ethernet switch cardCustom specific P-EXP based mezzanine switching module design
Power Requirements
DC Input, 9V-30V (12VDC, 24VDC nominal input voltage)Power consumption 25W max.Fast acting chip fuse (PCB soldered type - no replacement on-site)Protected against reverse polarityESD protection (TVS)Common mode input filterM12-A 5-pin front panel power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)
Applications
Ultra compact industrial PCX86 code compatibility for rapid time to marketMachine controlKiosk systems, information panelsDual 4k display solution, independent operationSingle display or headless applicationsIndustrial networks - IIoTCable and wireless networkingRouter, bridgesRugged environments, DIN rail or wall mount optionsEdge computingVehicles, transportation
Environmental, Regulatory
Designed & manufactured in GermanyCertified quality management according to ISO 9001Long term availabilityRugged solutionRoHS compliantOperating temperature -40°C to +85°C (industrial temperature range) availableStorage temperature -40°C to +85°C, max. gradient 5°C/minHumidity 5% ... 95% RH non condensingAltitude -300m ... +3000mShock 15g 0.33ms, 6g 6msVibration 1g 5-2000HzProtection class IP20EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)MTBF tbd years
EKF AC600 & AC610 DIN Rail Boxed PC
As we supply industrial equipment, product availability and delivery timelines may vary. Once your order is placed, our sales team will contact you within 24 business hours (excluding weekends and holidays) to confirm stock status and estimated delivery time.
