EKF AC600 & AC610 DIN Rail Boxed PC

General Low Power X86 based boxed PC, for DIN rail mount or wall mountIntel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable AC600/AC610 versions)Versatile standard front I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)Choice of two versions - without (AC600) or with (AC610) wireless networkingSMA/SMA-RP antenna connectors (AC610)Dimensions: 30mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC600)Dimensions: 40mm (W) x 140mm (H) x 150mm (D) w/o DIN rail bracket (AC610)Metal case, TS35 DIN rail bracket or wall mount plateM12 power connectorOption terminal block power connectorOption desktop power adapter connectorNominal 12V/24VDC power input operationFront I/O Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate front portsDual USB 3.0 Type-A receptaclesDual DisplayPort connectorsM12-A DC power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)Additional I/O AC610 AC610 is the wireless version of AC600 with AC010 mezzanine module (40mm front width)SMA/SMA-RP front antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5Dual Micro-SIM card slot for WWAN modem up to 5GProcessorIntel® Apollo Lake (APL-I) SoC E39xx Seriesx7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLCx5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLCx5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLCGraphics Burst, CPU Burst, Intel® Speedstep®Intel® Virtualization Technology (Intel® VT-x / VT-d)Intel® Trusted Execution Engine (Intel® TXE) 3.0FirmwarePhoenix® UEFI (Unified Extensible Firmware Interface) with CSM*Fully customizable by EKFSecure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®Windows®, Linux and other (RT)OS' supported* CSM (Compatibility Support Module) emulates a legacy BIOS environment, which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS' Main MemoryIntegrated memory controller up to 8GB DDR3L 1600 +ECCSoldered memory for rugged applicationsMass StorageOn-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)Up to 2TB capacity as of current - refer to AC600/610 SKUsOption front I/O Micro SD Card socket (SDHC, SDXC), available on requestSPI Flash 128Mbit (UEFI firmware and customer application data)Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)Option mezzanine storage expansion via P-HSE connector (up to 2 x PCIe®, 1 x USB 3.0)Option custom specific mezzanine board design on requestGraphicsIntegrated HD Graphics Engine, Gen 9 LPDirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8HW video encode H264, SVC, AVC, MVC, MPEG-2Content protection PAVP, HDCP 1.42 x DisplayPort front panel connectorsDisplayPort™ 1.2aMax Resolution 4096 x 2160 @60HzAudio streams encodedNetworkingDual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connectionsIntel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHYIPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient EthernetIEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streamsIEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronizationTwo front port M12-X connectorsOption 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)Wireless Networking AC610Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)APL SoC I/O Usage2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)2 x PCIe® to 2 x I210-IT networking controllers2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)1 x USB 3.0 to P-HSE high speed expansion port connector2 x USB 3.0 to front panel connectors2 x DisplayPort to front panel connectors1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)SDIO (Micro SD Card) front panel slot (option, available on request)LPC to TPM 2.0 module (option)Building Blocks2 x Gigabit Ethernet controllers Intel® I210IT (front panel)Option 1 x Intel® I210-IS (for SerDes networking expansion port connector P-EXP)M.2 socket for 2280 SSDOption e•MMC (embedded MMC 5.0 64GByte HS400)Option Trusted Platform Module TPM 2.0AC610 AdditionsM.2 socket for 2230 Wi-Fi moduleM.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)SecurityTrusted Platform Module (option)TPM 2.0 for highest level of certified platform protectionInfineon Optiga™ SLB 9665 cryptographic processorConforming to TCG 2.0 specificationAES hardware acceleration support (Intel® AES-NI)Local ExpansionMezzanine card connectors P-HSE and P-EXP for optional local expansionP-HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0Choice of P-HSE based mezzanine I/O or storage modulesAC010 P-HSE based wireless module for Wi-Fi, Bluetooth, WWAN connectivity (AC610)Custom specific P-HSE based mezzanine module designCustom specific box design for utilization of P-HSE custom I/O mezzanine modulesOption P-EXP connector - Gigabit Ethernet SerDes I/F derived from I210-IS NICCustom specific box design for utilization of P-EXP together with Gigabit Ethernet switch cardCustom specific P-EXP based mezzanine switching module designPower Requirements DC Input, 9V-30V (12VDC, 24VDC nominal input voltage)Power consumption 25W max.Fast acting chip fuse (PCB soldered type - no replacement on-site)Protected against reverse polarityESD protection (TVS)Common mode input filterM12-A 5-pin front panel power connectorOption terminal block 3.5mm pitch 4-position screw lock (bottom of box) power inputOption rear power connector (desktop supply 4-pos. circular connector)Applications Ultra compact industrial PCX86 code compatibility for rapid time to marketMachine controlKiosk systems, information panelsDual 4k display solution, independent operationSingle display or headless applicationsIndustrial networks - IIoTCable and wireless networkingRouter, bridgesRugged environments, DIN rail or wall mount optionsEdge computingVehicles, transportationEnvironmental, Regulatory Designed & manufactured in GermanyCertified quality management according to ISO 9001Long term availabilityRugged solutionRoHS compliantOperating temperature -40°C to +85°C (industrial temperature range) availableStorage temperature -40°C to +85°C, max. gradient 5°C/minHumidity 5% ... 95% RH non condensingAltitude -300m ... +3000mShock 15g 0.33ms, 6g 6msVibration 1g 5-2000HzProtection class IP20EC Regulations EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)MTBF tbd years