Acc. to IEEE 1386
Used on VME-, Future, CPCI- or MultibusII-Boards when additional interfaces are neededTwo designs are availabe: Zinc die-cast or aluminium extrusionMezzanine filler panel: To cover the unused Mezzanine cut outs. The filler panels are simply cliped into the cut-outs.The EMC-gaskets can be inserted into the groove of the front panels
